Description
The wafers with 115 mm diameter come in different materials and in thicknesses of between 1.0 mm and 4.0 mm. One unit contains 10 individually wrapped pieces. The dimensions of the material may differ in the range of 0.5 %, depending on the material.
Wafer 115 mm Diameter Various thicknesses Fluidic 300
A wafer with 115 mm diameter is the perfect starting point for hot embossing or as platform for surface chemistry experiments.
- Reference
- 10000867
- Usage Statement
- For R&D use only
- Fluidic
- 300
- Material
- PMMA
- Material chip body
- Mcs-PMMA 08
- Material chip lid
- No foil
- Color
- Transparent
- Interface type
- None
- Surface treatment
- Not treated
- Membrane
- No membrane
- Pieces per unit
- 10
Description
The wafers with 115 mm diameter come in different materials and in thicknesses of between 1.0 mm and 4.0 mm. One unit contains 10 individually wrapped pieces. The dimensions of the material may differ in the range of 0.5 %, depending on the material.
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- Fluidic
- 300
- Material
- PMMA
- Material chip body
- mcs-PMMA 08
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- PMMA
- Material chip body
- mcs-PMMA 08
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Topas
- Material chip body
- Mcs-COC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Topas
- Material chip body
- Mcs-COC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Topas
- Material chip body
- Mcs-COC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Topas
- Material chip body
- Mcs-COC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- PC
- Material chip body
- mcs-PC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- PC
- Material chip body
- mcs-PC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- PC
- Material chip body
- mcs-PC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 1
- Fluidic
- 300
- Material
- PC
- Material chip body
- mcs-PC 13
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 1
- Fluidic
- 300
- Material
- Zeonex
- Material chip body
- mcs-COP 04
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 1
- Fluidic
- 300
- Material
- Zeonex
- Material chip body
- mcs-COP 04
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonex
- Material chip body
- mcs-COP 04
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonex
- Material chip body
- mcs-COP 04
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonor
- Material chip body
- mcs-COP 02
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonor
- Material chip body
- mcs-COP 02
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonor
- Material chip body
- mcs-COP 02
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonor
- Material chip body
- mcs-COP 02
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
- Fluidic
- 300
- Material
- Zeonor
- Material chip body
- mcs-COP 02
- Material chip lid
- no foil
- Color
- Transparent
- Interface type
- none
- Surface treatment
- Not treated
- Membrane
- no membrane
- Pieces per unit
- 10
The wafers with 115 mm diameter come in different materials and in thicknesses of between 1.0 mm and 4.0 mm. One unit contains 10 individually wrapped pieces. The dimensions of the material may differ in the range of 0.5 %, depending on the material.
A wafer with 115 mm diameter is the perfect starting point for hot embossing or as platform for surface chemistry experiments.
A wafer with 115 mm diameter is the perfect starting point for hot embossing or as platform for surface chemistry experiments.
Wafer 115 mm Diameter - Various thicknesses - Fluidic 300